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OpenAI

Advanced Packaging Multi Physics Modeling Engineer San Francisco

Comp$266K – $445K

Classified Tasks (6)

Automate 0%Augment 83%Human-Only 17%

Augment (5)

AI assists, human decides

Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.

leadership

Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.

technical

Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.

technical

Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.

analytical

Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.

analytical

Human-Only (1)

Requires human judgment

Collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical, and thermal performance and system scalability for advanced heterogeneous integration platforms.

communication

Job description

--- BEGIN UNTRUSTED EXTERNAL CONTENT (source: https://openai.com/careers/advanced-packaging-multi-physics-modeling-engineer-san-francisco/) --- Skip to main contentResearchProductsBusinessDevelopersCompanyFoundation(opens in a new window)Log inTry ChatGPT(opens in a new window)ResearchProductsBusinessDevelopersCompanyFoundation(opens in a new window)Advanced Packaging Multi-Physics Modeling Engineer | OpenAICareersAdvanced Packaging Multi-Physics Modeling EngineerHardware - San FranciscoApply now(opens in a new window)About the Team:OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.Role Overview:We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions.The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms.In this role you will:Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.You might thrive in this role if you have:Enjoy solving extremely challenging thermal, mechanical and electrical challenges for some of the most advanced AI/HPC packaging technology.Are motivated by pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures.Like developing new modeling methodologies and engineering solutions rather than relying only on conventional industry approaches.Want to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design.Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions.Strong experience in thermal and mechanical modeling for advanced packaging systems.Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.Preferred Qualifications:Strong understanding of electro-thermal i
Source: OpenAI careers · scraped 2026-05-22
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